台灣豪威科技有限公司

1. Solid experience in image model development and training, including classification, segmentation, and generative tasks.

2. Proficiency in Python, PyTorch/TensorFlow, and common computer vision libraries (e.g., OpenCV).

3. Familiarity with generative models such as Diffusion and GANs, as well as multimodal AI applications.

4. Strong ability to build data pipelines, including dataset preparation, augmentation, and model evaluation.

5. Excellent problem-solving skills with effective communication for cross-functional collaboration.

6. Experience in deploying or integrating ML models into production or real-world systems is a plus.

7. Positive working attitude with the ability to work independently and deliver results.

1. Develop and optimize computer vision models such as classification, segmentation, detection, and generative models.

2. Research and apply the latest advancements in Vision AI, multimodal models, and Generative AI to support practical implementation.

3. Support the full model development workflow, including data preparation, training, evaluation, and deployment.

4. Work with cross-functional teams (software, process, automation, quality) to integrate AI models into inspection or manufacturing processes.

5. Build and maintain experimentation workflows, conduct model benchmarking, and assist with continuous improvement.

6. Prepare documentation for model architecture, training methods, experiment results, and deployment guidelines.

7. Communicate effectively with global teams to ensure requirement alignment and smooth project execution.

8. Complete tasks assigned by supervisors.

1. Experienced in semiconductor automation equipment development, including material/process selection, drives, pneumatics, electrical control, sensors, and cleanroom systems.

2. Solid understanding of material properties, processing methods, tolerances, and basic stress analysis.

3. Skilled in engineering drawing review, cost estimation, and schedule control.

4. Strong in fast problem-solving, logical analysis, and risk management.

5. Excellent communication skills; able to coordinate across teams and functions.

6. Proven ability to plan and execute experiments, validate results, and drive optimization.

7. Supports cross-site technical issues, including overseas production troubleshooting.

1. Equipment development evaluation, cost estimation, schedule planning, and project implementation, including necessary documentation such as validation, processes, controls, and logic.

2. Track and record the execution status of projects to ensure progress stays on track.

3. Define objectives and specifications for outsourced equipment, track development progress, and provide technical assistance or resource coordination during implementation.

4. Act as a coordinator to provide technical consultation, project management, and goal alignment between customers, users, and suppliers, eliminating information dispersion and unifying team efforts.

5. Other tasks assigned by supervisors.

MUST:
1. EE based knowledge; electronic circuit debug, and program development ability.

2. Good concept of computer structure.

PREFERRED :
1. Image process knowledge, Digital Testing concept.

2. CIS test debug, such as register/driver,and hardware setup experience;

3. C++/Python language develop experience.

1. Develop the CIS system-level test/wafer sort test program.

2. Debug the testing H/W issue.

3. Support the testing house ramp up for mass production, including the H/W and test program.

4. Support RD in collecting the characterization data log for process improvement.

5. Develop/Modify the image process algorithm for all testing failure modes.

6. Increase the test fault coverage to reduce the RMA DPPM.

7. Prepare the customer engineering samples.

8. Support assembly reliability qualification test.

9. Develop the Probecard/Loadboard for mass production.

10. Perform other assignments as assigned by the supervisor.

【實習期間】 1學期以上

【需求人數】 1位

【科系要求】電機/電子工程學系(所) ，大四以上/碩士在學的應屆畢業生

【擅長語言】C / C++, Python, Rust

【主修課程】Computing Science

【技能】
1. Computing Language : C/C++, Python, Rust
2. Known with git and CI/CD procedure.

【實習期間】可依個人課程安排於面談時討論，有相關研究及程式作品者尤佳

【為什麼需要這樣的人才？】培育軟體技術人才以因應公司未來產品量產需求。

※Internship Program※

【職務說明】

1.  Support to develop function from SQL to data visualization.

2.  Support to do data cleaning and labeling.

3.  Support to develop the function of statistical analysis for multi-dimensional data.

【工作內容】

Co-work with the data science team and support

1. Development and review of data procedure.

2. Data cleaning and labeling.

3. Statistic function development.

4. Other tasks assigned by supervisors.

【實習期間】 1學期以上

【需求人數】 1位

【科系要求】電機/電子工程學系(所) ，大四以上/碩士在學的應屆畢業生

【擅長語言】C / C++, Python, Rust

【主修課程】Computing Science

【技能】
1. Computing Language : C/C++, Python, Rust
2. Known with git and CI/CD procedure.

【實習期間】可依個人課程安排於面談時討論，有相關研究及程式作品者尤佳

【為什麼需要這樣的人才？】培育軟體技術人才以因應公司未來產品量產需求。

※Internship Program※

【職務說明】

1.  Target: For new graduates who love automation and machines.

2.  Goal: Turn school knowledge into real work experience.

3.  Growth: Looking for people who like to research and try new ideas.

4.  Team: Learn from seniors and share your thoughts with the team.

【工作內容】

Co-work with the data science team and support

1. Hardware Setup: Help build machines and adjust how they work.

2. Reading Drawings: Learn to read and check technical engineering drawings.

3. Reports: Help write project plans and technical reports.

4. Teamwork: Support the team with different tasks during design and testing.

5. Other tasks assigned by supervisors.

1. More than 5 years experience in probe card operation handing (CPC, VPC, MEMS probe card and driver probe card.

2. It is best to have both ME and EE experience for probe card repair and trouble shooting.

3. It is better to have CIS probe card relative handling experience.

4. Experience in cross-function communication and collaboration.

5. Experience with relevant measurement and validation tools for probe card issue clarify and trouble shooting.

6. Proficient in Microsoft Excel and PowerPoint tools.

1. Probe card solution evaluation including mechanical and electrical portion

2. Probe card issue study and fix solution introduction for mass production recovery quickly

3. New product probe card readiness schedule control and management with suppliers

4. Overall probe card resource control and management in testing houses

5. Complete other tasks assigned by the supervisor.

1. Hands-on experience in semiconductor packaging process development, preferably CIS WLCSP.

2. Experience working with OSATs or external manufacturing partners.

3. Strong cross-functional communication and project coordination skills.

4. OSAT management.

5. Experience in System-in-Package (SiP) or advanced packaging integration is a strong plus.

1. Develop and optimize CIS WLCSP packaging processes from NPI to mass production.

2. Drive project execution and technical alignment with OSAT partners.

3. Lead pre-HVM quality and system audits to ensure manufacturing readiness.

4. Resolve packaging process, yield, and reliability issues for new technology.

5. Collaborate with R&D, Product, Quality, Supply Chain, and Manufacturing teams.

6. Complete tasks assigned by supervisors.

1. Detail-oriented, determined, accountable, and a self-driven, proactive individual who can work accurately under pressure to meet deadlines and drive efficient production processes.

2. Proficiency with production planning software and ERP systems (e.g., Oracle, IFS).

3. Strong knowledge of Microsoft Office applications.

1. Manage and create weekly production schedules.

2. Ensure materials and packaging are available to meet demand.

3. Monitor and control daily production processes and plans.

4. Collaborate with quality control, warehouse staff, and other departments.

5. Create and present status and performance reports.

6. Complete tasks assigned by supervisors.

● Process experience requirements
1. 5+ years of working experience in process integration or product engineering in silicon foundry. CIS experience is a plus

2. Familiar with SPC control, 8D concept and statistical knowledge

3. Familiar with CP, FT and WAT analysis for quick yield ramp up in NTO and extreme yield challenge in mature product

4. Good at project management for problem definition, solution providing and implementation

● Coding experience requirements
1. Proficient in Python especially on image processing domain

2. Familiar with Java and imageJ for source code optimization

● Others
1. Team player, good communication and self-driven learning of new skills in AI domain

2. This is a practical assessment interview, so prepare your own laptop to demonstrate coding proficiency

● Yield enhancement related
1. kinds of yield and datalog tracing, including CP, ASSY, FT, for yield improvement and product performance monitoring

2. Low yield case/SBC hold lots analysis, root-case finding and solutions study via cross-department collaboration

3. In-line data and test data correlation for early detection of potential risk defect

4. NTO yield roadmap plan and timeline, AR tracing to make sure yield meet goal on schedule even pull in

● Software development related
1. In-house high efficient EDA development for specific data format

2. Image analysis tools development including efficient image processing, accurate image rendering, friendly UI design and unique functions matching with test algorithm

● Perform other assignments as assigned by the supervisor.

1.Experience in working directly with internal team members or external clients(e.g., technical consulting, engineering support, etc.).

2.Experience with image sensor product introduction

3.Experience with software system integration

4.Ability to work well in a cross-functional team environment.

5.Independent thinking capabilities and troubleshooting skills.

6.Auto report makeing experience.

7.Tool : Experience with Python、SPSS or SQL or R

1. Led the development of a fully automated Foundry Die Map collection and parsing engine.

2. Support engineers to devolops computer programs to collect and integrate data.

3. Resolve the pain point of heavy reliance on semi-manual coordinate alignment, achieving strong site-to-site correlation from Silicon Waste to Final Test

4. Responsible for the entire process of Database Schema design and database performance optimization from Silicon to Final Test.

5. Toward transforming raw data into meaningful and valuable information.

6. Data mining, data analysis, data processing.

7. Complete tasks assigned by supervisors.

MUST:
1. EE based knowledge; electronic circuit debug, and program development ability.

2. Good concept of driver IC structure.

PREFERRED :
1. Testing process knowledge and Driver test development experience.

2. Experienced with ND series tester (ADVANTEST).

3. C++ language development experience.

1. Implement test program of driver project.

2. Debug the testing issue.

3. Support the testing house ramp up for mass production, including the H/W and test program.

4. Analysis of low yield in mass production.

5. Support assembly reliability qualification test.

6. Optimize & Maintain the Probecard / Loadboard for mass production.

7. Perform other assignments as assigned by the supervisor.

【MUST】
1. EE based knowledge; electronic circuit debug, and program development ability.

2. Good concept of computer structure.

【PREFERRED】
1. Image process knowledge, Digital Testing concept.

1. Develop the CIS/LCoS CP and FT testing programs.

2. Trouble shooting on testing program, parts etc.

3. Support the sub-con ramp up for mass production.

4. Support RD collect the characterization datalog for process improvement.

5. Develop/Modify the image process algorithm for all testing failure mode.

6. Increase the test fault coverage to reduce the RMA DPPM.

7. Prepare the customer engineering samples.

8. Support Assembly reliability qualification test.

9. Perform other assignments as assigned by the supervisor.